کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
540581 | 871329 | 2010 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
In-situ metrology and testing of nanotwinned copper pillars for potential air gap applications
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
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چکیده انگلیسی
We have performed in-situ nanocompression testing in a transmission electron microscope (TEM) of copper pillars having dimensions of the same order of typical via and line structures used in the semiconductor industry. We show direct evidence that twin boundaries can withstand extensive plastic deformation and still retain their structure when compared to regular grain boundaries. Through real-time TEM observations we have verified the deformation mechanisms of twin boundaries predicted by molecular dynamic (MD) simulations. Our quantitative in-situ stress measurements are also in close agreement with those reported by MD and energetics based calculations.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 87, Issue 11, November 2010, Pages 2046–2049
Journal: Microelectronic Engineering - Volume 87, Issue 11, November 2010, Pages 2046–2049
نویسندگان
Vinay Sriram, Jenn-Ming Yang, Jia Ye, Andrew M. Minor,