کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
540813 | 871344 | 2007 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Integrated monitoring of ULK dielectrics out-gassing and measurement of pore sealing efficiency by residual gas analysis technique
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Integrated monitoring of ULK dielectrics out-gassing and measurement of pore sealing efficiency by residual gas analysis technique Integrated monitoring of ULK dielectrics out-gassing and measurement of pore sealing efficiency by residual gas analysis technique](/preview/png/540813.png)
چکیده انگلیسی
Residual gas analysis is a well-known technique used in the semi-conductor industry. This paper presents the RGA as an effective method to monitor wafer out-gassing during the degas process prior to barrier/copper seed deposition. The technique is easy to use, repeatable and very sensitive to the hydrophobic or hydrophilic nature of the surfaces. Moreover, it has been demonstrated that RGA is the technique of choice to evaluate the pore sealing efficiency of ultra low-k dielectric in high volume manufacturing environment.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 84, Issue 11, November 2007, Pages 2719–2722
Journal: Microelectronic Engineering - Volume 84, Issue 11, November 2007, Pages 2719–2722
نویسندگان
R. Delsol, L. Chapelon, H. Chaabouni, L. Broussous, M. Schellenberger, A. Ostrovski, P. Normandon,