Keywords: کم K; Low-k; Self-assembled monolayer; SAM; Spin coating; Pore sealing;
مقالات ISI کم K (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: کم K; Thermal barrier coating (TBC); Air plasma spray; Low-k; Rare earth zirconia; Composite; Erosion;
Keywords: کم K; Air gap; Capacitance simulation; Low-k; SiC liner; AG interconnects
Keywords: کم K; Low-k; Porosity; Mechanical properties; Plasma damage
Keywords: کم K; Low-k; Organosilicate glass; Amorphous materials; Replica exchange molecular dynamics; Interconnect structures
Narrowing of the Boolchand intermediate phase window for amorphous hydrogenated silicon carbide
Keywords: کم K; Silicon carbide; Plasma enhanced chemical vapor deposition; Low-k; Constraint theory; Boolchand; Amorphous;
A non-destructive, fast evaluation of PVD diffusion barriers deposited on porous low-k dielectrics
Keywords: کم K; Non-destructive evaluation; Diffusion barriers; Low-k; Spectroscopic ellipsometry;
Benzocyclobutene organosiloxane resins prepared by alcoholysis of BCB functionalized chlorosilane for highly crosslinked low-k thermosets
Keywords: کم K; Benzocyclobutene; Organosiloxane; Alcoholysis; Thermal stability; Low-k;
Design of high breakdown voltage vertical GaN p-n diodes with high-K/low-K compound dielectric structure for power electronics applications
Keywords: کم K; Gallium nitride; Diode; Breakdown voltage; High-K; Low-K; Vertical; Power device;
The effects of vacuum-ultraviolet radiation on defects in low-k organosilicate glass (SiCOH) as measured with electron-spin resonance
Keywords: کم K; Low-k; Dielectrics; Vacuum ultraviolet; Damage; Defect concentrations; Electron spin resonance
UV cure of oxycarbosilane low-k films
Keywords: کم K; Oxycarbosilane; Low-k; UV cure; HF stability
Surface sealing using self-assembled monolayers and its effect on metal diffusion in porous low-k dielectrics studied using monoenergetic positron beams
Keywords: کم K; Low-k; Pore; Self-assembled monolayer; Positron annihilation;
Effect of H2/He plasma treatment on porous low dielectric constant materials
Keywords: کم K; Low-k; Plasma; H2/He; Capacitive coupling plasma; Remote plasma; Electrical characteristics; Reliability; TDDB;
Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (BEOL) electrical reliability
Keywords: کم K; Low-k; Interconnect; Band diagram; XPS; EPR; Magnetic resonance
Impedance spectroscopy studies of moisture uptake in low-k dielectrics and its relation to reliability
Keywords: کم K; Low-k; Impedance spectroscopy; Dielectric relaxation; AC losses; Time dependent dielectric breakdown; Reliability;
Mechanical properties of low k SiO2 thin films templated by PVA
Keywords: کم K; Porous silica film; Low-k; Mechanical properties
Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films
Keywords: کم K; SAM; Self-assembled monolayer; Low-k; Pore sealing; Pore stuffing;
Pore morphology of low-k SiCxNy films prepared with a cyclic silazane precursor using plasma-enhanced chemical vapor deposition
Keywords: کم K; Low-k; Silicon carbonitride; Thin Films; Pore morphology; Grazing-incidence small-angle X-ray scattering;
Effects of UV curing on the self-forming barrier process of Cu–V alloy films
Keywords: کم K; Copper diffusion barrier; Self-forming barrier; Low-k; UV curing
Decreasing the relative permittivity of LTCC by porosification with poly(methyl methacrylate) microspheres
Keywords: کم K; LTCC; PMMA; Low-k; Porous
Low-k a-SiCO:H films as diffusion barriers for advanced interconnects
Keywords: کم K; SiCO; Low-k; Copper barrier; TDDB; Moisture barrier; Copper interconnects
Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young’s modulus
Keywords: کم K; Low-k; PECVD; SiCOH; Thin films
As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability
Keywords: کم K; Donor-like trap; C-V hysteresis; Low-k; TDDB; BEOL reliability;
Influence of porosity and methyl doping inside silica network: An electron diffraction and DFTB analysis
Keywords: کم K; Low-k; Electron diffraction; RDF; DFTB
Wetting behavior of plasma treated low-k films in dHF cleans solutions
Keywords: کم K; Low-k; Wetting; Evaporation loss; Contact angle
Effect of O2 plasma treatment on physical, electrical, and reliability characteristics of low dielectric constant materials
Keywords: کم K; Low-k; O2 plasma; He/H2 remote plasma; Electrical properties; Reliability
Influence of hydrogen content and network connectivity on the coefficient of thermal expansion and thermal stability for a-SiC:H thin films
Keywords: کم K; Silicon carbide; Coefficient of thermal expansion; Plasma enhanced chemical vapor deposition; Low-k; Constraint theory
In situ FTIR experimental results in the silylation of low-k films with hexamethyldisilazane dissolved in supercritical carbon dioxide
Keywords: کم K; HMDS; In situ FTIR; Silylation; scCO2; Heterogeneous reaction; Low-k
Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC:H thin films
Keywords: کم K; Silicon carbide; Bond percolation; Constraint theory; Low-k; Plasma; Chemical vapor deposition;
Investigation of gate length and fringing field effects for program and erase efficiency in gate-all-around SONOS memory cells
Keywords: کم K; Gate-all-around (GAA); Silicon nanowire; SONOS; Gate length; Erasing saturation; Low-k; Permittivity; Inter-layer dielectric; Fringing field
Chemisorption of ALD precursors in and on porous low-k films
Keywords: کم K; Low-k; Thin films; Atomic layer deposition
Moisture absorption impact on Cu alloy/low-k reliability during process queue time
Keywords: کم K; Electromigration; Time dependent dielectric breakdown; Copper alloy interconnects; Low-k; Moisture absorption; Queue time
Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films in Cu/low-k interconnects
Keywords: کم K; ALD TaN; Cu diffusion barrier; Triangular voltage sweep; Plasma treatment; Low-k
Modeling of TDDB in advanced Cu interconnect systems under BTS conditions
Keywords: کم K; Low-k; Reliability; Modeling; Time-dependent dielectric breakdown; Bias-temperature stress
Effective Cu surface pre-treatment for high-reliable 22 nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k = 2.2)
Keywords: کم K; Cu interconnect; Low-k; Cu surface treatment; Plasma damage; Electro-migration
Effect of surfactants on the porogen size in the low-k methylsilsesquioxane/polystyrene hybrid films
Keywords: کم K; Porogen; Pore size; Surfactant; Low-k; GISAXS
Magma systems of the Kutcharo and Mashu volcanoes (NE Hokkaido, Japan): Petrogenesis of the medium-K trend and the excess volatile problem
Keywords: کم K; Caldera; Magmatic volatiles; Medium-K; Low-K
Influence of oxygen plasma treatment on properties of Methyl-BCN film
Keywords: کم K; Methyl; Low-k; Ashing; BCN
Integrated diffusion–recombination model for describing the logarithmic time dependence of plasma damage in porous low-k materials
Keywords: کم K; Plasma damage; Recombination; Diffusion; Low-k; Porous
Effect of porogen residue on electrical characteristics of ultra low-k materials
Keywords: کم K; Low-k; Porogen residue
Evaluating k-values for low-k materials after damascene integration: Method and results
Keywords: کم K; Low-k; Damascene; Capacitance; Dielectric; Integration
Interconnect reliability – A study of the effect of dimensional and porosity scaling
Keywords: کم K; Copper; Low-k; Reliability; Electromigration; SIV; FEM; TDDB
Controlling solvent diffusivity via architecture of nanopore structures in porous low-k films
Keywords: کم K; Silsesquioxane; Low-k; Nanoporous; Pore interconnectivity; Solvent diffusivity
From single molecules to micelles – An in situ study of porogen aggregation and nanopore formation mechanisms in porous thin films
Keywords: کم K; Silsesquioxane; Low-k; Pore structure; Positronium Annihilation Lifetime Spectroscopy (PALS); Ellipsometric Porosimetry (EP)
Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance
Keywords: کم K; Low-k; UV-cure; Plasma damage; Porosity; Porogen residues; Ellipsometry
Mass and bond density measurements for PECVD a-SiCx:H thin films using Fourier transform-infrared spectroscopy
Keywords: کم K; Silicon carbide; FTIR; PECVD; Low-k; Bond density
Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC:H thin films
Keywords: کم K; Silicon carbide; FTIR; Plasma; Chemical vapor deposition; Low-k;
Influence of the methyl group on the dielectric constant of boron carbon nitride films containing it
Keywords: کم K; Low-k; Methyl group; ULSI
Effect of top power on a low-k film during oxygen strip in a TCP etch chamber
Keywords: کم K; Plasma; Etch; Dry etch; Plasma etch; Damage; Low-k; Oxygen; Power; Top power; FTIR; Radicals; Ions; Strip; Interconnects; SiOCH; Optical; Emission; Optical emission; Spectra; Reactive ion etch; Ion; RIE; Bottom power; TCP; Transformer coupled plasma
In situ X-ray diffraction study of self-forming barriers from a Cu–Mn alloy in 100 nm Cu/low-k damascene interconnects using synchrotron radiation
Keywords: کم K; Self-forming barrier; Manganese; Oxidation; In situ; Damascene; Low-k; X-ray diffraction; Synchrotron; Stress; Texture