کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
541314 | 1450361 | 2014 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effect of via/line temperature inhomogeneity on electromigration fast WLR results and how to get rid of inhomogeneities
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
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چکیده انگلیسی
• Conventional EM fWLR EM tests suffer from strong temperature inhomogeneities.
• As a consequence these tests tend to cause erroneous lifetimes.
• A new EM fWLR test system is presented.
• It reliably eliminates via/line temperature inhomogeneities for the first time.
• For any quantitative assessments temperature homogeneity is mandatory.
Electromigration fWLR tests lack validity because of unresolved temperature inhomogeneities in the test structures. A new system quantifies the undesirable impact of temperature inhomogeneities on lifetime results and demonstrates that temperature gradients can be completely avoided for any process/material change or process instability in any common technology.
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ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 120, 25 May 2014, Pages 95–98
Journal: Microelectronic Engineering - Volume 120, 25 May 2014, Pages 95–98
نویسندگان
M. Traving, W. Walter,