کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
541387 871463 2011 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Bond pad surface quality for reliable wire bonding
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Bond pad surface quality for reliable wire bonding
چکیده انگلیسی

The impact of fluoride and AlOx contaminants on the quality of wire bonding (Au to Al welding) has been measured. No or minor impact of these contaminants has been found with a standard ball shear test. Despite an accelerated lifetime test, the shear strength remains above the required specification limits. Intermetallic coverage, the percentage of the interface between the bond ball and the bond pad where welding resulted in intermetallic diffusion, gives a better picture of the quality decay, but this method is too elaborate for production control and specification limits are unclear.

Figure optionsDownload as PowerPoint slideResearch highlights
► Contamination of aluminum bond pads with fluoride or oxide layers have no or minor impact on the gold wire bond quality indicator, i.e. ball shear test.
► In accelerated lifetime test, this quality indicator remains within specification.
► Closer optical inspection of the aluminum gold weld shows that intermetallic formation was not formed over the full contact area.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 88, Issue 12, December 2011, Pages 3452–3458
نویسندگان
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