کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
542949 1450378 2013 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Fabrication of diamond conditioners by using a micro patterning and electroforming approach
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Fabrication of diamond conditioners by using a micro patterning and electroforming approach
چکیده انگلیسی

Micro patterning and nickel electroforming, which are commonly used in MEMS process to fabricate microstructures or micro components, were employed in this study for the fabrication of diamond conditioners. The thickness of the JSR THB-151 N resist on the stainless steel substrate can reach up to 75 μm, which is sufficient for forming a mask. The diamond grits which were embedded in the nickel deposit formed microcolumns array on the substrate with the guidance of the resist mold. By using this technique, the population density of the working diamond grits in the diamond conditioner can be increased. Moreover, an extra strike nickel plating was performed to functionalize the surface of the nickel deposit for increasing the polarization of the nickel deposit which can eliminate the edge effect in the enhancement electroplating process. This fabrication process developed herein can produce diamond conditioners with improved uniformity in both distribution and protrusion control of micro column diamond cutting tips. In addition, the developed diamond conditioners exhibit an increase in material removal rate (MRR) by some 15%, while, at the same time, maintain a relatively low worn rate as compared to the commercially available conditioners.

Figure optionsDownload as PowerPoint slideHighlights
► Diamond micro-columnar arrays can be formed by micro patterning and electroforming.
► Micro columns with diamond embedded in the nickel deposit on the stainless steel.
► The developed dresser exhibits an increase in material removal rate by some 15%.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 103, March 2013, Pages 92–98
نویسندگان
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