Size effect in bi-crystalline micropillars with a penetrable high angle grain boundary

The implications of various size effects on the deformation behavior of and near grain boundaries is not yet fully understood. In this manuscript, slip transfer mechanisms through a general high angle grain boundary (HAGB) allowing for easy transfer are investigated in order to understand the size dependence of the dislocation-grain-boundary interaction. Complementary in situ micro compression tests on copper single and bi-crystals in the scanning electron microscope and with x-ray Laue microdiffraction were used to correlate the mechanical response with the evolving microstructure. It is shown that no dislocation pile-up is formed at the boundary. The lack of pile-up stresses results in a deformation process which is dominated by the initial dislocation source statistics. This is evidenced by similar size scaling of the single and bi-crystalline samples with the grain size being the characteristic length scale.

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