Fabrication of insulated metal substrates with organic ceramic composite films for high thermal conductivity

Insulated metal substrates (IMSs) were fabricated and characterized using an organic ceramic composite as a coating mixture. Organic‐inorganic sol solutions were prepared by a sol‐gel process using TEOS (tetraethylorthosilicate), MTMS (methyltrimethoxysilane) and PhTMS (phenyltrimethoxysilane). Ceramic fillers were composed of aluminum oxide (1 and 4 µm) and silicon nitride. The optimal ratio of ceramic filler in the coating mixture was found to be 70 wt%. A thermal conductivity of 3.16 W/mK and a breakdown voltage of 4 kV with a leakage current of 0.17 mA/cm2 were obtained for the 122 µm-thick film. A well-networked microstructure between the sol resin and filler in the organic ceramic composite films enhanced the properties of the IMS, such as thermal conductivity and electric insulation.