کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
543865 871689 2008 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Investigation of three-dimensional pattern collapse owing to surface tension using an imperfection finite element model
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Investigation of three-dimensional pattern collapse owing to surface tension using an imperfection finite element model
چکیده انگلیسی

Precise fabrication of three-dimensional (3D) microstructures having nano-details has become realized using two-photon induced photopolymerization (TPP) since several years ago; and now, this technology is recognized as a promising process for the creation of 3D neo-conceptive nano- and microscale devices. However, there are still important issues to be settled for the practical use of TPP. One of them is the 3D pattern collapse due to the surface tension of rinse materials in a development process, which impedes the progress of 3D precise microfabrication via TPP. To solve this issue effectively, finite element analyses of 3D pattern collapse using an imperfection model were conducted. Overall of this work, we showed the mechanism of 3D pattern collapse and the way how to reduce pattern deformation effectively during a developing process using experimental and analytical approaches.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 85, Issue 2, February 2008, Pages 432–439
نویسندگان
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