A numerical study on nano-indentation induced fracture of low dielectric constant brittle thin films using cube corner probes

• Radial crack initiation and propagation in brittle films during cube corner indentation is modelled.
• The elastic and cohesive damage parameters of low-k films (OSG 2.4) were identified.
• A parametric study was conducted on the impact of elastic and cohesive properties of thin films.

In this study, a finite element (FE) model of indentation induced fracture of brittle thin films on tough substrates using the cube corner probes is developed utilising the cohesive zone method. The model is specifically applied to brittle low dielectric constant (low-k) thin films and is corroborated by comparison to experimental results. It is shown that the model can decipher mechanisms of radial crack initiation and propagation during loading and unloading phases consistent with experiments. As such, the model lends itself to use as a platform for quantitative and mechanistic understanding of thin film mechanics and characterisation of their fracture properties.

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