Study on the usage of a commercial software (Comsol-Multiphysics®) for dislocation multiplication model

In a first approach, A&H physical model is introduced for a 2D axisymmetric geometry. After a short introduction, modification of Comsol® software is presented in order to include A&H equations. This numerical model calculates dislocation density and plastic stress continuously during ingot solidification and cooling. Results of this model are then compared to home-made simulation created by the teams at Kyushu university and NTNU. Results are also compared to characterization of a silicon ingot elaborated in a gradient freeze furnace. Both of these comparisons shows the relevance of using a commercial code, as Comsol®, to predict dislocations multiplication in a silicon ingot during elaboration.