Dynamic delamination of drying colloidal films: Warping and creep behavior

• We examine out-of-plane displacement of thin colloidal films during the drying process.
• Different behaviors can be distinguished from elastic to plastic then creep.
• Direct characterization of the mechanical properties is supported by measurements using indentation testing.

During the consolidation of thin films, mechanical instabilities usually result from large mechanical stresses development. In particular morphologies of fractures and debonding reveal different behaviors of the materials. We report dynamic debonding induced by drying process of colloidal systems by direct measurements in a one-dimensional geometry. From the measurements of the film out-of-plane displacement, different behaviors can be distinguished from elastic to plastic then creep. The time evolution of the mechanical properties of colloidal films is in accordance with measurements using indentation testing as a response to an external force.

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