Simulation analysis on surface morphology and hysteresis characteristics of molten Sn-3.0Ag-0.5Cu sitting on the inclined Ni substrate

- Sn-3.0Ag-0.5Cu wetting on the inclined Ni substrate is performed at high temperature.
- Curve fitting for profiles of droplets are presented to calculate contact angles.
- Contact angle hysteresis with different inclinations of the substrate is discussed.
- Moving characteristics of the front and rear triple points are investigated.
- Surface Evolver is employed to simulate spreading behavior of the molten solder.