کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
593944 1453962 2012 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Influence of anionic polyelectrolyte addition on ceria dispersion behavior for quartz chemical mechanical polishing
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی شیمی کلوئیدی و سطحی
پیش نمایش صفحه اول مقاله
Influence of anionic polyelectrolyte addition on ceria dispersion behavior for quartz chemical mechanical polishing
چکیده انگلیسی

In this study, the effect of anionic dispersant, poly(acrylic acid-co maleic acid) sodium salt on ceria (CeO2) slurry stability was investigated for quartz chemical mechanical polishing (CMP) applications. The properties of the ceria slurry, including pH, viscosity, and stability behavior as a function of dispersant concentrations (0.1, 1, 3 and 5 wt%), were characterized to identify optimized conditions for the polishing process. With the addition of dispersant, the pH of ceria slurry increased to an alkaline regime which is compatible for quartz CMP processing while the viscosity sharply increased at 5 wt%. The stability results show that the slurry is stable only at 3 wt%, whereas the particles become agglomerated and settle quickly at all other dispersant concentrations. Adsorption and electrokinetic behavior of the ceria slurry were measured to understand the ceria slurry behavior at various dispersant concentrations. At low concentrations, the dispersant does not protect the particles enough to overcome the van der Waals attraction forces, whereas, at higher concentrations, particle agglomeration occurs due to bridging flocculation. At the optimum concentration, the dispersant provides enough steric hindrance to overcome the attractive force. In addition, the presence of sodium ions in the dispersant also strongly influences the settling behavior of ceria particles. The polishing test showed that the desired removal rate and surface quality could be achieved with the optimized slurry.

Surface roughness and removal rates after quartz substrate polishing at an optimized ceria slurry condition.Figure optionsDownload as PowerPoint slideHighlights
► New ceria chemistry with additive (PAMS) is proposed for quartz CMP.
► We report the adsorption behavior of PAMS on ceria and slurry stability behavior.
► The viscosity and electro kinetic behavior is different from other common additives.
► The mechanism explains ceria suspension behavior at various additive concentration.
► The desired surface quality of quartz could be achieved with the proposed chemistry.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Colloids and Surfaces A: Physicochemical and Engineering Aspects - Volume 411, 5 October 2012, Pages 122–128
نویسندگان
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