Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 137, 2 April 2015, Pages 101-104

Parisa Bayat, Dietmar Vogel, Raul D. Rodriguez, Evgeniya Sheremet, Dietrich R.T. Zahn, Sven Rzepka, Bernd Michel,