Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process

Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 108, August 2013, Pages 33-38

Dewen Zhao, Tongqing Wang, Yongyong He, Xinchun Lu,