Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography

► The first results of tensile stress tests of thin film Au wires on a PI substrate. ► The test structures were fabricated by stencil lithography using SiN stencils. ► Within the limit of elastic deformation, the resistance change was less than 6%. ► No change of thin film surface morphology was found after 10000 of stretching cycles. ► Stencil lithography is a promising fabrication method for stretchable interconnects.