کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7150567 | 1462193 | 2018 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Comparison of work function variation between FinFET and 3D stacked nanowire FET devices for 6-T SRAM reliability
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی برق و الکترونیک
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
In this work, work-function variation (WFV) on 5â¯nm node gate-all-around (GAA) silicon 3D stacked nanowire FET (NWFET) and FinFET devices are studied for 6-T SRAM cells through 3D technology computer-aided design (TCAD) simulation. The NWFET devices have strong immunity for the unprecedented short channel effects (SCEs) compared with the FinFET devices owing to increased gate controllability. However, due to the narrow gate area, the single NWFET is more vulnerable to WFV effects than FinFET devices. Our results show that the WFV effects on single NWFETs are larger than the FinFETs by 45-55%. In the case of standard SRAM bit cells (high density: 111 bit cell), the variation of read stability (read static noise margin) on single NWFETs are larger than the FinFETs by 65-75%. Therefore, to improve the performance and having immunity to WFV effects, it is important to analyze the degree of variability in 3D stacked device architectures without area penalty. Moreover, we investigated the WFV effects for an accurate guideline with regard to grain size (GS) and channel area of 3D stacked NWFET in 6-T SRAM bit cells.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Solid-State Electronics - Volume 140, February 2018, Pages 74-79
Journal: Solid-State Electronics - Volume 140, February 2018, Pages 74-79
نویسندگان
Kyul Ko, Dokyun Son, Myounggon Kang, Hyungcheol Shin,