Solution flow rate influence on properties of copper oxide thin films deposited by ultrasonic spray pyrolysis

The present work is an investigation of the solution flow rate influence on copper oxide (CuO) thin film properties deposited by ultrasonic spray pyrolysis. A set of CuO thin films were deposited, with various solution flow rates, on glass substrate at 300 °C. The precursor solution is formed with copper salt dissolution in distilled water with 0.05 molarity. The solution flow rate was ranged from 10 to 30 ml/h. Films composition and structure were characterized by means of XRD (X Rays diffraction) and Raman scattering. The optical properties were studied using UV–visible spectroscopy. The electrical conductivity, carrier mobility and concentration were determined by Hall Effect measurements. The obtained results indicate that flow rate is a key parameter controlling CuO films growth mechanism and their physical properties. The prepared films are mainly composed with a CuO monophase, the crystallite size is reduced with increasing the flow rate. A ZnO/CuO heterojunction structure has been realized and its rectifying behavior is tested.