150-mm layer transfer for monocrystalline silicon solar cells

We report on recent improvements concerning the transfer of monocrystalline silicon layers to plastic substrates for flexible solar cell applications. Finite element numerical modeling of the etching current density distribution allows for optimizing our electrochemical etching setup for separation layer formation. By modifying the setup according to the simulation results, we are now able to transfer 25 μm thick monocrystalline silicon sheets with up to 150 mm in diameter.