Poly(ester imide)s possessing low coefficients of thermal expansion (CTE) and low water absorption (III). Use of bis(4-aminophenyl)terephthalate and effect of substituents

A variety of poly(ester imide)s (PEsIs) were prepared using bis(4-aminophenyl)terephthalate (BPTP) and substituted BPTP (BPTP series) for applications to novel base film materials in flexible printed circuit boards (FPC). BPTP series were all highly reactive with various tetracarboxylic dianhydrides and led to considerably high molecular weights of PEsI precursors. The thermally imidized BPTP-based PEsI films achieved lower extents of water absorption (WA) than the corresponding 4-aminophenyl-4′-aminobenzoate (APAB)-based PEsI systems while keeping other target properties, in particular, the linear coefficient of thermal expansion (CTE) much lower than that of copper foil as a conductive layer in FPC. The lower WA is attributed to the decreased imide contents in the structure by using BPTP. The considerably low CTE can be explained in terms of intimate stacking between the p-aromatic ester fragments with an extended conformation. The BPTP-based PEsI system also exhibited a considerably low dissipation factor (tan δ = 1.91 × 10−3) at a high-frequency electric field of 18.3 GHz, comparable to a liquid–crystalline polyester. An effect of substituents on the film properties was also investigated in this work. Incorporation of methyl substituents on BPTP was very effective for property improvement, whereas methoxy substituents on BPTP, as well as methyl substituents onto hydroquinone bis(trimellitate anhydride) (TAHQ), showed a trend to significantly increase the CTE. Copolymerization with an adequate amount of a typically flexible monomer, 4,4′-oxydianiline (4,4′-ODA), allowed the CTE matching with copper foil and the film toughness improvement at the same time. The PEsI copolymer prepared from TAHQ (10 mmol) with methyl-substituted BPTP (7 mmol) and 4,4′-ODA (3 mmol) achieved excellent combined properties, namely, a very high Tg at 410 °C, a slightly lower CTE (10.0 ppm/K) than that of copper foil, suppressed water absorption (0.35%), an extremely low linear coefficient of humidity expansion (CHE = 3.4 ppm/RH%), and good film toughness (the elongation at break, εb = 50.7%). Thus, BPTP- and methyl-substituted BPTP-based PEsI systems can be promising candidates as a next generation of FPC base film materials.

A novel copoly(ester imide) was developed as a next generation of FPC base film materials. This film achieved excellent combined properties, namely, a very high Tg at 410 °C, a low linear coefficient of thermal expansion (CTE) of 10.0 ppm/K, a suppressed extent of water absorption (0.35%), an extremely low linear coefficient of humidity expansion (CHE = 3.4 ppm/RH%), and good film toughness (the elongation at break = 50.7%).Figure optionsDownload as PowerPoint slide