کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1402740 984782 2009 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure
موضوعات مرتبط
مهندسی و علوم پایه شیمی شیمی آلی
پیش نمایش صفحه اول مقاله
Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure
چکیده انگلیسی

The fluorene-containing epoxy, diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized by a two-step reaction procedure. In order to investigate the relationship between fluorene structure and material properties, DGEBF and a commonly used diglycidyl ether of bisphenol A (DGEBA) were cured with 4,4-diaminodiphenyl methane (DDM) and 4,4-(9-fluorenylidene)-dianiline (FDA). The curing kinetics, thermal properties and decomposition kinetics of these four systems (DGEBA/DDM, DGEBF/DDM, DGEBA/FDA, and DGEBF/FDA) were studied in detail. The curing reactivity of fluorene epoxy resins was lower, but the thermal stability was higher than bisphenol A resins. The onset decomposition temperature of cured epoxy resins was not significantly affected by fluorene structure, but the char yield and Tg value were increased with that of fluorene content. Our results indicated that the addition of fluorene structure to epoxy resin is an effective method to improve the thermal properties of resins, but excess fluorene ring in the chain backbone can depress the curing efficiency of the resin.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: European Polymer Journal - Volume 45, Issue 7, July 2009, Pages 1941–1948
نویسندگان
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