کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1447581 988649 2010 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effect of heat treatment temperature on the microstructure and actuation behavior of a Ti–Ni–Cu thin film microactuator
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Effect of heat treatment temperature on the microstructure and actuation behavior of a Ti–Ni–Cu thin film microactuator
چکیده انگلیسی

Ti–Ni–Cu/SiO2 two layer diaphragm-type microactuators were fabricated by sputter deposition and micromachining. The influence of heat treatment temperature on the actuation behavior was investigated under quasi-static conditions. The interfacial structure of Ti–Ni–Cu/SiO2 and internal structure of the Ti–Ni–Cu layer were also investigated using transmission electron microscopy. The reaction layer formed between the Ti–Ni–Cu and SiO2 layers, and preferentially grew into the SiO2 side. The reaction layer formed at 1023 K mainly consisted of Ti4(Ni,Cu)2O. The maximum height of the diaphragm decreased with increasing heat treatment temperature. The growth of the reaction layer also affected the microstructure of the Ti–Ni–Cu layer. The density of fine platelets and Ti2Ni precipitates decreased with increasing heat treatment temperature from 873 to 923 K, and they disappeared at 973 K due to the fact that the reaction layer mainly consisted of a Ti-rich phase. The microactuator heat treated at 973 K showed the highest transformation temperature with the lowest transformation temperature hysteresis, which is attractive for high speed actuation.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Acta Materialia - Volume 58, Issue 18, October 2010, Pages 6064–6071
نویسندگان
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