کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1448350 | 988671 | 2008 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
The evolution of SnCu intermetallic compounds (IMCs) between a molten SnAgCu alloy and the Cu under-bump metallization (UBM) throughout reflow is presented based on interruption of soldering reactions in experiments by removing the liquid solder from the substrate. This allows to capture and visualize interfacial reactants at arbitrary moments of the soldering process, and to gain an insight into their formation characteristics. The results show that the interfacial Cu6Sn5/Cu3Sn structure is formed at an early stage of reflow and is maintained throughout the process. Based on the experiments, formation mechanisms of interfacial CuSn IMCs are discussed.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Acta Materialia - Volume 56, Issue 16, September 2008, Pages 4291–4297
Journal: Acta Materialia - Volume 56, Issue 16, September 2008, Pages 4291–4297
نویسندگان
Jicheng Gong, Changqing Liu, Paul P. Conway, Vadim V. Silberschmidt,