Studies on recrystallization of single-phase copper alloys by resistance measurements

Copper-based solid solutions with different contents of solute elements (Zn, Al, Ga, Sn, Ge) were deformed at room temperature and at liquid nitrogen temperature. The recrystallization behaviour of these alloys has been investigated by means of dynamic and isothermal measurements of the resistivity (ρ)(ρ). Variations of dρ/dTdρ/dT from ρ0α are interpreted in terms of changes in defect densities by recovery and recrystallization. Deviations from a linear temperature dependence of the resistivity increase with increasing solute concentration. This deviation (i.e. ΔρrecΔρrec as determined at room temperature) also depends on the stacking fault energy γγ. We observe a 1/γ21/γ2-dependency of ΔρrecΔρrec which is also influenced by the deformation temperature. During deformation, γγ controls the possibility of storing deformation energy in the form of dislocations and deformation twins. In combination with the general trend of alloying elements to shift recrystallization to higher temperatures, the recrystallization behaviour of single-phase copper alloys has been described qualitatively.