Technology aspects of GaN-based diodes for high-field operation

This work reports important aspects of technology development and characterization for GaN based diodes operating at high electric fields. The considered operation conditions result, in comparison to III–V semiconductor devices, from the higher values of threshold field for intervalley transfer of electrons. This lies above 150 kV/cm and requires correspondingly higher biasing voltages and currents through semiconducting layers of transferred electron devices, switches or NDR (negative differential resistance) diodes. Mesa-based vertical and lateral devices using GaN layers on sapphire substrate were considered for current–voltage characteristics under very high electric field conditions. A systematic investigation of MOCVD-grown diode structures with regular, tapered mesa designs and variable dimensions was carried out under pulsed-bias condition. The current–voltage characteristics showed threshold voltages for saturation corresponding to electric fields well above the critical value of 150 kV/cm in the active layer. Self-heating and electromigration effects have been addressed in relation with biasing and metallization conditions.