The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn-Ag lead free solder alloy

► Sn-3.5Ag (SA) alloy & SA with nano sized Mo and Ni at three different wt.% was investigated. ► Creep behaviour was investigated using a constant load method in nanoindenter. ► Modified Garofalo's equation demonstrated an excellent fit to indentation creep data. ► Steady state creep rate decreased with increasing addition of Mo and Ni to base alloy. ► Primary creep stage displacement and time decreased with increasing Mo and Ni wt.%.