Hypersingular integral equation based micromechanical models for a microscopically damaged antiplane interface between a thin elastic layer and an elastic half space

Two micromechanical models based on the hypersingular integral formulations are presented for estimating the effective stiffness of a micro-cracked interface between a thin elastic layer and an elastic half space under antiplane deformations. The three-phase model simplifies the interface into three parts – micro-cracked, perfectly bonded and effective regions. The micromechanical–statistical model takes into consideration statistical variations in the lengths of randomly positioned interfacial micro-cracks. Some parametric studies are carried out on how the plane boundary of the thin layer and the material properties of the thin layer and the half space affect the effective stiffness of the interface.