کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
196015 459830 2006 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Obtaining of high surface roughness copper deposits by electroless plating technique
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی مهندسی شیمی (عمومی)
پیش نمایش صفحه اول مقاله
Obtaining of high surface roughness copper deposits by electroless plating technique
چکیده انگلیسی

The use of pyridine-2,6-dicarboxylic and 4-hydroxypyridine-2,6-dicarboxylic acids as copper(II) ligands in formaldehyde-containing alkaline electroless copper plating solutions allowed to obtain copper layers with extremely high surface roughness factor reaching approximately 120. The Cu deposits of higher surface area were formed at highly negative open-circuit (mixed) potentials; the correlation between copper electrode overpotential and roughness of the deposit was found and discussed. The copper films obtained demonstrate a high electrocatalytic activity in anodic formaldehyde oxidation process, the oxidation rate reaches 40 mA cm−2 and exceeds considerably that for other copper surfaces.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Electrochimica Acta - Volume 51, Issue 17, 25 April 2006, Pages 3495–3499
نویسندگان
, , , , ,