کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
196015 | 459830 | 2006 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Obtaining of high surface roughness copper deposits by electroless plating technique
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
مهندسی شیمی (عمومی)
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چکیده انگلیسی
The use of pyridine-2,6-dicarboxylic and 4-hydroxypyridine-2,6-dicarboxylic acids as copper(II) ligands in formaldehyde-containing alkaline electroless copper plating solutions allowed to obtain copper layers with extremely high surface roughness factor reaching approximately 120. The Cu deposits of higher surface area were formed at highly negative open-circuit (mixed) potentials; the correlation between copper electrode overpotential and roughness of the deposit was found and discussed. The copper films obtained demonstrate a high electrocatalytic activity in anodic formaldehyde oxidation process, the oxidation rate reaches 40 mA cm−2 and exceeds considerably that for other copper surfaces.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Electrochimica Acta - Volume 51, Issue 17, 25 April 2006, Pages 3495–3499
Journal: Electrochimica Acta - Volume 51, Issue 17, 25 April 2006, Pages 3495–3499
نویسندگان
Eugenijus Norkus, Algirdas Vaškelis, Janė Jačiauskienė, Irena Stalnionienė, Giedrius Stalnionis,