Electrodeposition of copper on Ru(0 0 0 1) in sulfuric acid solution: Growth kinetics and nucleation behavior

The electrodeposition of Cu on Ru(0 0 0 1) from 0.1 M CuSO4/0.5 M H2SO4 solution has been studied by cyclic voltammetry, current–time transient measurements, and by in situ electrochemical atomic force microscopy (EC-AFM). Cyclic voltammetry measurements show that the as-prepared Ru(0 0 0 1) electrode exhibits a UPD peak, while EC-AFM data indicate a broadly terraced surface with step heights of atomic dimensions. Kinetic data show that the electrodeposition/nucleation process is not well described by 3D or 2D nucleation models. The EC-AFM data show that at potentials near the OPD/UPD threshold, Cu crystallites exhibit pronounced growth anisotropy, with lateral dimensions greatly exceeding vertical dimensions. AFM data also show that deposition at more cathodic potentials result in smaller crystallites.