Comparison of HF and HCl cross-contamination between different ENTEGRIS FOUP platforms and Cu-coated wafers

Comparison of HF and HCl cross-contamination between different ENTEGRIS FOUP platforms and Cu-coated wafers

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 169, 5 February 2017, Pages 34-38

Fernando Herrán, Paola González-Aguirre, Carlos Beitia, Jim Ohlsen, Jorgen Lundgren, Hervé Fontaine,