AR-HPES study on chemical bonding states of high-κ/high-μ gate stacks for advanced CMOS

Hard X-ray photoemission spectroscopy experiments are attractive because they can probe more deeply. The paper reviews two topics on the non-destructive characterization of high-κ/high-μ gate stacks using hard X-ray (hν = 7.94 keV) photoemission spectroscopy. The first topic is the change in the compositional depth profiles and the chemical bonding states of HfO2/Si-cap/strained-Ge/Si0.5Ge0.5/Si(1 0 0) laminating structures. The second topic is the influence of various surface treatments (HF, (NH4)2S and HMDS treatments) and La2O3 interlayer insertion on the chemical bonding states at high-κ/In0.53Ga0.47As interface.