کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
539827 | 1450368 | 2014 | 4 صفحه PDF | دانلود رایگان |
• Vertical etching of an ion beam sputtered SiO2/Si multilayer stack is presented.
• The stack was etched with a single step C4F8 and O2 based ICP–RIE process.
• A profile of 90° and smooth sidewalls were the result of the vertical etching.
• A deposition technique of a durable, defect free, steep Cr hard mask is described.
• Selectivity between the multilayer stack and Cr hard mask was 77:1.
Deep vertical etching of a 10 μm thick SiO2/Si multilayer stack is presented. The stack was deposited by ion beam sputtering. To etch the stack, an octafluorocyclobutane (C4F8)–oxygen (O2) based inductively coupled plasma - reactive ion etching (ICP–RIE) process was developed. The recipe shows very similar etching rates for silicon dioxide (SiO2) and silicon (Si); thus it can be implemented as a simple one step etching process. In order to protect the stack properly during the etching, a durable hard mask is required. Investigations of the deposition of such a mask, using chromium (Cr) deposited by electron beam physical vapour deposition (EBPVD), are also presented.
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Journal: Microelectronic Engineering - Volume 113, January 2014, Pages 70–73