کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
543339 871653 2009 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Electrochemical behavior of copper and cobalt in post-etch cleaning solutions
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Electrochemical behavior of copper and cobalt in post-etch cleaning solutions
چکیده انگلیسی

Cleaning is one of the key steps of the integration of self aligned barriers (SAB) in microelectronic devices for 32 nm technology and below. It is hence important to investigate the impact of different cleaning solutions on the metallic components of SAB, mainly in which concerns their surface stability. In this sense, the electrochemical behavior of copper and cobalt was studied under potentiodynamic conditions in different aqueous solutions of glycolic acid (GA) with and without benzotriazole (BTA) inhibitor.It has been observed that the presence of glycolic acid induces a monotonic increase of copper corrosion and a slight decrease in the case of cobalt. The cobalt dissolution remains nonetheless very active and is shown to be governed by oxygen reduction reaction. The addition of BTA, a well-known corrosion inhibitor for copper has shown to be also effective in the case of Co surfaces, with a ca 15-fold reduction of the intrinsic Co corrosion current density.The possibility of galvanic coupling between both metals, supposed to enhance the Co dissolution, has also been qualitatively investigated and seems not to be a determinant factor in these conditions.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 86, Issue 10, October 2009, Pages 2038–2044
نویسندگان
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