کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
543713 | 1450396 | 2008 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Fabrication of micro mold for hot-embossing of polyimide microfluidic platform by using electron beam lithography combined with inductively coupled plasma
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
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چکیده انگلیسی
This study describes the fabrication of Si molds by using electron beam lithography (EBL) combined with inductively coupled plasma (ICP) etching and its application to the hot-emboss of polyimide (PI) microfluidic platform. The dynamic mechanical thermal properties and the formability of a polyimide film were investigated as a function of temperature by dynamic mechanical thermal analysis (DMTA) and hot-embossing tests. Based on the results, the microfluidic channel could be replicated on PI surface with good fidelity by hot-embossing with the Si mold structured by using EBL combined with ICP etching.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 85, Issues 5–6, May–June 2008, Pages 918–921
Journal: Microelectronic Engineering - Volume 85, Issues 5–6, May–June 2008, Pages 918–921
نویسندگان
Sung-Won Youn, Toshihiko Noguchi, Masaharu Takahashi, Ryutaro Maeda,