کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
543713 1450396 2008 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Fabrication of micro mold for hot-embossing of polyimide microfluidic platform by using electron beam lithography combined with inductively coupled plasma
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Fabrication of micro mold for hot-embossing of polyimide microfluidic platform by using electron beam lithography combined with inductively coupled plasma
چکیده انگلیسی

This study describes the fabrication of Si molds by using electron beam lithography (EBL) combined with inductively coupled plasma (ICP) etching and its application to the hot-emboss of polyimide (PI) microfluidic platform. The dynamic mechanical thermal properties and the formability of a polyimide film were investigated as a function of temperature by dynamic mechanical thermal analysis (DMTA) and hot-embossing tests. Based on the results, the microfluidic channel could be replicated on PI surface with good fidelity by hot-embossing with the Si mold structured by using EBL combined with ICP etching.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 85, Issues 5–6, May–June 2008, Pages 918–921
نویسندگان
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