Interface engineering for low power and uniform resistive switching in bi-layer structural filament type ReRAM

Interface engineering for low power and uniform resistive switching in bi-layer structural filament type ReRAM

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 109, September 2013, Pages 385-388

Daeseok Lee, Jiyong Woo, Euijun Cha, Seonghyun Kim, Wootae Lee, Sangsu Park, Hyunsang Hwang,