کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
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728215 | 1461405 | 2016 | 6 صفحه PDF | دانلود رایگان |
Tiny defects may escape from in-line defect scan and pass WAT (Wafer Acceptance Test), CP (Chip Probing), FT (Final Test) and SLT (System Level Test). Chips with such kind of defects will cause reliability problem and impact revenue significantly. It is important to catch the defects and derive the prevention strategy earlier in the technology development stage. In this paper, we investigate an SRAM with tiny defects which passed in-line defect scan, WAT, CP and FT but failed in HTOL (High Temperature Operation Life) test, one of the product reliability qualification items. FA (Failure Analysis) reveals gate oxide missing defect is the root cause. The goal is to pass reliability qualification and release product into production on schedule. The failure mechanism, optimization of gate oxide process, enhancement of defect scan and testing methodology will be introduced. Experiment results show very good HTOL performance by the combination of process and testing optimization.
Journal: Materials Science in Semiconductor Processing - Volume 41, January 2016, Pages 485–490