کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
728632 1461427 2014 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effects of Cu incorporation on physical properties of ZnTe thin films deposited by thermal evaporation
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی برق و الکترونیک
پیش نمایش صفحه اول مقاله
Effects of Cu incorporation on physical properties of ZnTe thin films deposited by thermal evaporation
چکیده انگلیسی

The present paper reports on a systematic study of the Cu doping effect on the optical, electrical and structural properties of ZnTe:Cu (Cu=0, 6, 8, and 10 at%) thin films. Polycrystalline Cu-doped ZnTe thin films were deposited on glass substrates at room temperature by thermal evaporation. A detailed characterization of the Cu-doped ZnTe films were performed by X-ray diffraction (XRD), Spectrophotometry, Fourier transform infrared spectroscopy (FT-IR) and Raman spectroscopy. XRD of the as-deposited Cu-doped ZnTe films belong to single-phase cubic structure of ZnTe with preferential orientation along (111) planes revealed minor effect of Cu content. The interference pattern in optical transmission spectra was analyzed to determine energy band gap, refractive index, extinction coefficient and thickness of the films. Wemple–DiDomenico and Tauc's relation were used for the determination and comparison of optical band gap values. The formation of ZnTe and Cu-doped ZnTe phase was confirmed by FT-IR. AC conductivity in a frequency range of 0–7 MHz has been studied for investigation of the carriers hoping dynamics in the films. Raman spectra indicated merely typical longitudinal optical (LO) phonon mode of the cubic structure ZnTe thin film at 194 cm−1 because the excitation energy is well above of the optical band-gap of the material and exhibited a blue-shift from 194 to 203 cm−1 with Cu which could be associated to the substitution of Zn atom with Cu at the lattice sites.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science in Semiconductor Processing - Volume 19, March 2014, Pages 17–23
نویسندگان
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