Keywords: بسته بندی الکترونیکی; Silver-aluminum direct bonding; Solid-state bonding process; Intermetallic compound; Fracture mechanism; Electronic packaging;
مقالات ISI بسته بندی الکترونیکی (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: بسته بندی الکترونیکی; Analytical solutions; Reliability; Response surface methodology; Electronic packaging; Vibration loading;
Keywords: بسته بندی الکترونیکی; Carbon fibre reinforced aluminium matrix; Heat transfer; Modelling; Numerical simulation; Electronic packaging;
Keywords: بسته بندی الکترونیکی; Mixed nano paste; Sintering; Electrochemical migration; Electronic packaging;
Keywords: بسته بندی الکترونیکی; Moisture diffusion; Multi-material systems; Microelectronics; Water activity; Nonlinear sorption isotherm; Electronic packaging;
Keywords: بسته بندی الکترونیکی; Sintered silver; Harsh environment; Nanosilver; Die-attach; Electronic packaging; Low temperature joining technique;
Keywords: بسته بندی الکترونیکی; Moisture diffusion; Normalized concentration; Dynamic temperature; Electronic packaging;
Keywords: بسته بندی الکترونیکی; Ball grid array (BGA); Discrete phase model (DPM); Electronic packaging; Nano-silica composite-encapsulant; Underfill encapsulation;
Keywords: بسته بندی الکترونیکی; Silver-zinc solid solution; Silver; Ingot growth; Electronic packaging; Tensile deformation; Fractography;
Keywords: بسته بندی الکترونیکی; Heat transfer; electronic packaging; computation; heat sink;
Keywords: بسته بندی الکترونیکی; Electronic packaging; Aluminium matrix composites; Silicon particle; Thermal conductivity; Flexural strength;
Keywords: بسته بندی الکترونیکی; Copper/carbon nanotube composite; Modeling; Current density; Through silicon vias; Electronic packaging;
Keywords: بسته بندی الکترونیکی; Magnetic nanoparticles; Solder composites; Microstructure; Mechanical property; Electronic packaging;
Keywords: بسته بندی الکترونیکی; Thermal contact resistance; Multiscale method; Electronic packaging
Keywords: بسته بندی الکترونیکی; Cycloaliphatic epoxide; Sulfite; Thermal degradation; Reworkable; Electronic packaging;
Keywords: بسته بندی الکترونیکی; Electronics; Thermal control; Natural convection; Low powered QFN64b; Wire-bonding technique; Electronic packaging; Convective heat transfer coefficient; Correlations
Characterization of novel high-speed die attachment method at 225 °C using submicrometer Ag-coated Cu particles
Keywords: بسته بندی الکترونیکی; Sintering; Surface modification; Nanostructured materials; Electronic packaging; Bonding by silver dewetting;
Failure mechanism of Ag-4Pd alloy wire bonded on Al-Si metallization under high temperature storage and thermal cycle tests in corrosive environments
Keywords: بسته بندی الکترونیکی; Silver alloy; Thin film; Electronic packaging; Intermetallics; Galvanic corrosion;
Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy
Keywords: بسته بندی الکترونیکی; Electronic packaging; Zinc; Tin; Finite element method; SEM; Nernst-Planck equation;
Modeling AOD-driven laser microvia drilling with machine learning approaches
Keywords: بسته بندی الکترونیکی; Laser micromachining; Electronic packaging; Laser drilling; Acousto-optic deflector; Machine learning; Artificial neural network;
The mechanism of pore segregation in the sintered nano Ag for high temperature power electronics applications
Keywords: بسته بندی الکترونیکی; Electronic packaging; Sintering; Porous material; High temperature reliability;
The fabrication of functional gradient hypereutectic Al-Si composites by liquid-solid separation technology
Keywords: بسته بندی الکترونیکی; Liquid-solid separation; Metal-matrix composites; Functional gradient composites; Electronic packaging; Coefficient of thermal expansion;
Thermal and electrical properties of SiO2/SiC-epoxy composite by surface oxidation of silicon carbide
Keywords: بسته بندی الکترونیکی; Thermal property; Electrical property; Silicon carbide; Surface oxidation; Electronic packaging;
Investigation of soldering process and interfacial microstructure evolution for the formation of full Cu3Sn joints in electronic packaging
Keywords: بسته بندی الکترونیکی; Electronic packaging; Full Cu3Sn joints; Soldering temperature; Soldering pressure; Soldering time; Interfacial microstructure evolution;
Free convective heat transfer coefficient for high powered and tilted QFN64 electronic device
Keywords: بسته بندی الکترونیکی; Electronics; Thermal control; Natural convection; High powered QFN64; Electronic packaging; Convective heat transfer coefficient; Correlations;
Experimental and Numerical Study of Natural Convection for High Powered and Wire-Bonded QFN64b Electronic Device
Keywords: بسته بندی الکترونیکی; Electronics; Thermal control; Natural convection; High powered QFN64b; Wire-bonding technique; Electronic packaging; Convective heat transfer coefficient; Correlations;
A metastable phase of tin in 3D integrated circuit solder microbumps
Keywords: بسته بندی الکترونیکی; Lead-free solder; Metastable phases; Electronic packaging; Joining;
Metastable eutectic in Pb-free joints between Sn-3.5Ag and Ni-based substrates
Keywords: بسته بندی الکترونیکی; Microstructure; Intermetallic compounds; Eutectic solidification; Lead-free solder; Electronic packaging; Aging;
Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints
Keywords: بسته بندی الکترونیکی; Sn–Ag solder; Low-Ag content solder; Electronic packaging; Electroless nickel immersion gold (ENIG); Electroless nickel–electroless palladium–immersion gold (ENEPIG)
Fabrication of diamond particles reinforced Al-matrix composites by hot-press sintering
Keywords: بسته بندی الکترونیکی; Vacuum hot-pressing sintering; Diamond/Al; Electronic packaging; Thermal conductivity; Coefficient of thermal expansion
Microstructure and properties of electronic packaging box with high silicon aluminum-base alloy by semi-solid thixoforming
Keywords: بسته بندی الکترونیکی; high silicon aluminum-base alloy; electronic packaging; semi-solid thixoforming; thermal conductivity; coefficient of thermal expansion;
Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging
Keywords: بسته بندی الکترونیکی; Ag nanoparticle paste; Sintering; Pressureless bonding; Electronic packaging;
Thermo-initiated cationic polymerization of phosphorus-containing cycloaliphatic epoxides with tunable degradable temperature
Keywords: بسته بندی الکترونیکی; Cycloaliphatic epoxide; Cationic polymerization; Thermal degradation; Electronic packaging;
Demonstration of silver micro-joints for flip-chip interconnect
Keywords: بسته بندی الکترونیکی; Silver; Silver joints; Flip-chip; Interconnect; Solid-state bonding; Electronic packaging;
Optimization of inkjet printed PEDOT:PSS thin films through annealing processes
Keywords: بسته بندی الکترونیکی; Inkjet printing; Thin film; Annealing; PEDOT:PSS; Electronic packaging
Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn-Ag-Cu solder and ENEPIG substrate during a reflow process
Keywords: بسته بندی الکترونیکی; Sn-Ag-Cu solder; Soldering; Intermetallic compounds; Electronic packaging;
Enhanced solder joint bonding strength of electronic packaging with electrowetting effect
Keywords: بسته بندی الکترونیکی; Electrowetting-on-dielectric; Solder joint; Bonding strength; Electronic packaging; Silicon based system in package
Review of metal matrix composites with high thermal conductivity for thermal management applications
Keywords: بسته بندی الکترونیکی; metal matrix composites; electronic packaging; thermal conductivity; coefficient of thermal expansion; brazing
Different microstructure BaO–B2O3–SiO2 glass/ceramic composites depending on high-temperature wetting affinity
Keywords: بسته بندی الکترونیکی; Glass–ceramics; Electronic packaging; Wetting; Dielectrics
Phosphorus-containing liquid cycloaliphatic epoxy resins for reworkable environment-friendly electronic packaging materials
Keywords: بسته بندی الکترونیکی; Epoxy resin; Synthesis; Electronic packaging;
Preparation of Sn–3.5Ag nano-solder by supernatant process
Keywords: بسته بندی الکترونیکی; Electronic packaging; Nano-materials; Solder; Supernatant process
Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending
Keywords: بسته بندی الکترونیکی; Analytical solutions; Mechanical bending; Drop shock; Solder joints; Electronic packaging
Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
Keywords: بسته بندی الکترونیکی; Fatigue crack propagation; Lead-free solder; Electronic packaging; Drop impact; Low cycle fatigue
Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging
Keywords: بسته بندی الکترونیکی; 85.85.j; 42.82.Cr; 81.65.CfDeep reactive ion etching; Electronic packaging; Micromasking effect; Silicon pillars; Heat dissipation; MEMS
Natural convection with distributed heat source modulation
Keywords: بسته بندی الکترونیکی; Natural convection; Heat transfer; Heat modulation; Electronic packaging
Experimental investigation of microchannel coolers for the high heat flux thermal management of GaN-on-SiC semiconductor devices
Keywords: بسته بندی الکترونیکی; Microchannel cooler; Single phase flow; Electronic packaging; Diamond
Diode laser soldering using a lead-free filler material for electronic packaging structures
Keywords: بسته بندی الکترونیکی; 42.55.Px; 81.20.Vj; 07.05.Tp; 68.35.Fx; Laser; Soldering; Lead-free; Thermal modelling; Electronic packaging;
The evaluation of mechanical stresses developed in underlying silicon substrates due to electroless nickel under bump metallization using synchrotron X-ray topography
Keywords: بسته بندی الکترونیکی; 62.20.âx; 61.72.Ff; 07.10.Pz; 85.40.Sz; 85.40.âe; 85.40.Ls; 89.20.+a; 61.10.Yh; 65.70.+y; 68.35.Ct; 68.35.Gy; Electroless Ni(P) deposition; Under-bump metallization (UBM); Strain; Electronic packaging; Reliability; Solder bump; X-ray topography;
Thermal cycle response of a lead-free solder reinforced with adaptive shape memory alloy
Keywords: بسته بندی الکترونیکی; Solders; Electronic packaging; Shape memory alloy; NiTi; Creep; Composite; Eshelby
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
Keywords: بسته بندی الکترونیکی; Conductive adhesives; Tin–lead alloys; Electronic packaging; Die attach; Lead free; Self-assembled monolayer