
Relative roles of acetic acid, dodecyl sulfate and benzotriazole in chemical mechanical and electrochemical mechanical planarization of copper
Keywords: دستگاه نیمه هادی; 68.08.-p; 68.43.-h; 81.20.-n; 81.65.-b; 82.45.Bb; CMP; Copper; Acetic acid; Surface composition; Semiconductor devices;