کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10620619 | 988645 | 2011 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effects of solidification kinetics on microstructure formation in binary Sn-Cu solder alloys
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Three binary Sn-Cu solder alloys of near-eutectic composition have been directionally solidified at different growth rates. The competition between primary tetragonal Sn cells/dendrites and eutectic is interpreted with the coupled zone concept. It is also found that Sn-Cu is a weakly irregular eutectic system with Cu6Sn5 leading the eutectic, but two different eutectic morphologies (coarse and fine) form simultaneously during eutectic growth. At higher growth rates, the eutectic interface breaks down into a cellular eutectic with the fine eutectic in the centre of the cells and the coarse one at the cell boundaries. This is explained by the segregation of Pb impurities ahead of the eutectic interface.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Acta Materialia - Volume 59, Issue 4, February 2011, Pages 1651-1658
Journal: Acta Materialia - Volume 59, Issue 4, February 2011, Pages 1651-1658
نویسندگان
Tina Ventura, Sofiane Terzi, Michel Rappaz, Arne K. Dahle,