کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10670065 | 1008846 | 2012 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effect of copper concentration in printable copper inks on film fabrication
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
Precursor-type Cu inks were formulated by mixing copper (II) formate and hexylamine. The lowest electrical resistivity obtained in Cu films made from these inks was 5.2 μΩ·cm. The Cu concentrations in the inks influenced the impurity content after annealing and the microstructure (specifically, the porosity). Inks with a higher volume of hexylamine had a narrower size distribution of Cu particles, so they formed denser films. However, a large volume of hexylamine could not be fully vaporized during a limited annealing time and reacted with formate, creating impurities having boiling temperatures higher than that of hexylamine. Therefore, the Cu concentration governed two factors, porosity and impurity content, which ultimately determined the electrical resistivity of the films. These findings are expected to facilitate the development of copper-based metallic inks for printed electronics.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 520, Issue 7, 31 January 2012, Pages 2731-2734
Journal: Thin Solid Films - Volume 520, Issue 7, 31 January 2012, Pages 2731-2734
نویسندگان
Suk Jun Kim, Jaeho Lee, Yun-Hyuk Choi, Dong-Hee Yeon, Younghun Byun,