A chemical kinetics model to explain the abrasive size effect on chemical mechanical polishing

A chemical kinetics model was proposed to describe the abrasive size effect on chemical mechanical polishing (CMP). The model is based on the consideration of a pad as a sort of catalyst and the re-adhering of abrasives due to the large size. Therefore, a general equation was deduced according the chemical kinetics methodology to give the meanings of the size effect. Finally, according a set of data related to the abrasive size effect on CMP, a possible form can be PR=αCCCTXACWAn/[β+γXACWAn] where α, β, γ and n are the parameters in a CMP system.