کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
10671043 1009031 2005 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Improved adhesion of Au thin films to SiOx/Si substrates by dendrimer mediation
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
Improved adhesion of Au thin films to SiOx/Si substrates by dendrimer mediation
چکیده انگلیسی
Quantitative evidence of significantly improved interfacial adhesion between Au films and SiOx/Si substrates induced by an organic dendrimer monolayer was presented. For dendrimer-mediated Au films, nanoscratch tests revealed a critical load that was two times higher than that for films without dendrimer mediation. Atomic force microscopy (AFM) examination of nanoindents revealed much constrained lateral flow of metals in the dendrimer-mediated Au films during nanoindentation, indicating enhanced adhesion due to the presence of the dendrimer layer.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 473, Issue 1, 1 February 2005, Pages 164-168
نویسندگان
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