کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1447578 | 988649 | 2010 | 11 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Microstructure evolution during dewetting in thin Au films
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Thin metal films can degrade into particles in a process known as dewetting. Dewetting proceeds in several stages, including void initiation, void growth and void coalescence. Branched void growth in thin Au films was studied by means of electron backscatter diffraction (EBSD). The holes were found to protrude into the film predominantly at high angle grain boundaries and the branched shape of the holes can be explained by surface energy minimization of the grains at the void boundaries. (1 1 1) Texture sharpening during dewetting was observed and quantified by EBSD and in situ X-ray studies.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Acta Materialia - Volume 58, Issue 18, October 2010, Pages 6035–6045
Journal: Acta Materialia - Volume 58, Issue 18, October 2010, Pages 6035–6045
نویسندگان
Claudia Manuela Müller, Ralph Spolenak,