کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1448485 | 988675 | 2009 | 13 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Peritectic solidification of Cu–Sn alloys: Microstructural competition at low speed
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Directional solidification experiments on Cu–Sn peritectic alloys have been conducted at very low velocity in a high-thermal-gradient Bridgman furnace. The size of the samples has been reduced in order to decrease natural convection and the associated macrosegregation. At the lowest growth rates (0.5 and 0.58 μm s−1), eutectic-like α + β lamellar structures have been observed in near-peritectic composition alloys over several millimeters of growth. These structures resulted from a destabilization of a band structure in which α- and β-phases overlay each other. Electron backscattered diffraction measurements revealed that bands and lamellae of a solid phase are continuous and originate from a single nucleus.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Acta Materialia - Volume 57, Issue 1, January 2009, Pages 56–68
Journal: Acta Materialia - Volume 57, Issue 1, January 2009, Pages 56–68
نویسندگان
F. Kohler, L. Germond, J.-D. Wagnière, M. Rappaz,