Micro-scale modification of diamond-like carbon and copper electroplating by scanning probe field emission current method

Micro-scale modification of nitrogen-doped diamond-like carbon (DLC) is performed by applying an electric field between a tungsten tip and DLC film surface in vacuum using the scanning probe field emission current (SPFEC) method. The dc voltage ranging from −700 V to −3000 V is applied to the tip. Then, electroplating of Cu is performed on the DLC film surface in CuCl2 solution by a three electrode-cell. The cathodic polarization curves indicate that the start potential of Cu on modified DLC film is shifted to a lower value than that of Cu on an as-grown DLC film. Cu deposits selectively on the DLC surface modified by an electric field. With this technique, the micro-scale patterning of Cu can be achieved by electroplating without a lithographic process.