Structured SiCu thin films in LiB as anodes

• Cu and Si atoms were co-evaporated to form composite thin film.
• GLAD is an alternative method to form new electrodes for LIB.
• Uses of the composite helices and nanocolumns as anodes were shown experimentally.
• IAD was used to improve the adhesion of the structured thin films.
• High surface area, porosities and Cu presence improve the Si anode performance.

Both helical and inclined columnar Si–10 at.% Cu structured thin films were deposited on Cu substrates using glancing angle deposition (GLAD) technique. In order to deposit Cu and Si two evaporation sources were used. Ion assistance was utilized in the first 5 min of the GLAD to enhance the adhesion and the density of the films. These films were characterized by thin film XRD, GDOES, SEM, and EDS. Electrochemical characterizations were made by testing the thin films as anodes in half-cells for 100 cycles. The results showed that the columnar SiCu thin film delivered 2200 mAh g− 1, where the helical one exhibited 2600 mAh g− 1, and, their initial coulombic efficiencies were found to be 38%–50% respectively. For the columnar and the helical thin film anodes, sustainable 520 and 800 mAh g− 1 with 90% and 99% coulombic efficiencies were achieved for 100 cycles. These sustainable capacities showed the importance of the thin film structure having nano-sized crystals and amorphous particles. The higher surface area of the helices increases the capacity of the electrode because the contact area of the thin film anode with Li ions is increased, and the polarization which otherwise forms on the anode surface due to SEI formation is decreased. In addition, because of larger interspaces between the helices the ability of the anode to accommodate the volumetric changes is improved, which results in a higher coulombic efficiency and capacity retention during cycling test.