کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1665853 1518056 2013 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Characterization and in-situ monitoring of sub-stoichiometric adjustable superconducting critical temperature titanium nitride growth
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
Characterization and in-situ monitoring of sub-stoichiometric adjustable superconducting critical temperature titanium nitride growth
چکیده انگلیسی


• Properties of reactively sputtered TiNx are controlled by argon:nitrogen process gas ratio.
• The superconducting transition temperature, Tc, is reduced for lower nitrogen content.
• Lower nitrogen content corresponds to greater (111) TiN and Ti2N texture.
• The optical properties of TiNx are related to these compositional changes.
• The position dependence of the optical properties predicts the Tc variation.

The structural and electrical properties of Ti–N films deposited by reactive sputtering depend on their growth parameters, in particular the Ar:N2 gas ratio. We show that the nitrogen percentage changes the crystallographic phase of the film progressively from pure α-Ti, through an α-Ti phase with interstitial nitrogen, to stoichiometric Ti2N, and through a substoichiometric TiNx to stoichiometric TiN. These changes also affect the superconducting transition temperature, TC, allowing, the superconducting properties to be tailored for specific applications. After decreasing from a TC of 0.4 K for pure Ti down to below 50 mK at the Ti2N point, the TC then increases rapidly up to nearly 5 K over a narrow range of nitrogen incorporation. This very sharp increase of TC makes it difficult to control the properties of the film from wafer-to-wafer as well as across a given wafer to within acceptable margins for device fabrication. Here we show that the nitrogen composition and hence the superconductive properties are related to, and can be determined by, spectroscopic ellipsometry. Therefore, this technique may be used for process control and wafer screening prior to investing time in processing devices.Contribution of the U.S. government, not subject to copyright.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 548, 2 December 2013, Pages 485–488
نویسندگان
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