A direct method to measure the fracture toughness of indium tin oxide thin films on flexible polymer substrates

• A straightforward method to measure the film's toughness
• Directly using the load-depth curve of nanoindentation
• The toughness is consistent with the critical load tested by micro scratch.
• Interlayers can improve the film's toughness.
• Optical and electric performances are also discussed.

This work presents a straightforward method to measure the fracture toughness of thin films deposited on flexible substrates. A 200 nm thick indium tin oxide (ITO) thin film is deposited on a 188 μm thick terephthalate (PET) substrate by a radio frequency magnetron sputtering machine. Using nanoindentation to induce brittle fracture on the ITO thin films, the energy release is calculated from integrating the resulting load–depth curve. An approach that directly measures the fracture toughness of thin films deposited on flexible substrates is proposed. A comparison shows that the results of the proposed method agree well with those of other reports. Furthermore, in order to improve the toughness of the ITO thin films, a copper interlayer is added between the ITO thin film and PET substrate. It shows that the fracture toughness of the ITO thin film deposited on the copper interlayer is higher than that of the one without the interlayer, which agrees well with the critical load tested by micro scratch. Further observations on optical and electric performances are also discussed in this work.